Global R&D Center of TSMC Started Operation,

High-end Semiconductor Technology Innovation Is Taking Root in Taiwan

Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) held an inauguration ceremony for its Global R&D Center at the Hsinchu Science Park on July 28, 2023, which was presided over by TSMC’s Chairman, Mr. Dey-In Liu, and President Zhe-Jia Wei. Founder of TSMC, Mr. Morris Chang, Premier Chen of the Executive Yuan, Chairman Wu of the National Science and Technology Council, Minister Wang of the Ministry of Economic Affairs, County Mayor Yang of Hsinchu County, Director General Wang of the Hsinchu Science Park Bureau, together with distinguished guests and local celebrities were invited to attend the ceremony.

TSMC announced 3nm mass production process at the end of 2022, creating an important milestone for advanced semiconductor manufacturing processes. In June 2023, TSMC announced an official launch of its sixth advanced packaging and testing fab to realize the 3D Fabric™ integration of front-end 3D silicon stacking and back-end advanced packaging technology, which achieved a remarkable breakthrough in packaging technology. Opening of the R&D center at the Hsinchu Park and the 12-inch advanced production plant under construction are expected to attract more than 8,000 R&D engineers in the future.