NEPCON China 2021
April 21 - 23, 2021
Shanghai world Expo Exhibition & Convention Center
About NEPCON China
2021 will be held in Shanghai World Expo Exhibition and Convention Center from
April, 2021. As an international event for the electronic manufacturing
industry, it will focus on the display of equipment & technology of surface
mount technology (SMT), soldering and dispensing, smart factory and automation,
test and measurement, and new electronic materials. The Expo will attract more
than 500 exhibitors and brands, displaying innovative solutions to more than
30,000 professional buyers from EMS/OEM/ODM factories of consumer electronics
and hot industries and fields such as 5G, communication, smart home, IoT,
automotive electronics and semiconductor packaging.
NEPCON China 2021 will specially launch
innovative pavilion and conferences such as the Electronic Micro-Assembly &
SiP Process Pavilion, the Electronic Micro-Assembly & SiP Process
Conference, 2021 AWC Conference on Development and Testing Technologies for NEV
Electromobility System and the Smart Manufacturing Dream Factory Conference, concurrently
with the Smart Factory and Automation Technology Expo, to lead the future trend
of smart manufacturing in the electronic industry. By participating in the
NEPCON China, industrial well-known forums and high-end conferences, business
recommendation and match-making services, and new product guide tour, the
visitors can obtain new industry technologies, gain insight into product trends
and achieve one-stop purchasing.
• <Surface Mount
Technology Pavilion> covers the complete production chain
including mounting, welding, dispensing and spraying, testing and measurement,
and intensively displays the well-known brands in the world.
• <Smart Factory
& Automation Technology Expo 2019> displays the applications
of advanced “industrial automation” technology and “system integration” plan in
electronics manufacturing industry.
Materials Pavilion> provides a business platform for electronic
material enterprises to communicate with the R&D and design personnel of
terminal users, project manager / leader, technical personnel, purchase /
marketing / sales personnel in the form of “meeting + pavilion”.
Micro-assembly and SiP Process Pavilion> serves as a
comprehensive professional exhibition platform of electronic micro-assembly,
circuit board assembly and finished product assembly that leads the development
trend of advanced packaging industry.
• <Test and
Measurement Pavilion> a professional exhibition and conference
platform that is dedicated to displaying electronic product testing technology,
leading the development trend of testing and measuring industry, and
disseminating the advanced factory management concepts and latest industry
• <Soldering and
Dispensing Pavilion> display new equipment and new technology
at site and provide buyers with more intelligent welding, dispensing and
spraying technology options.
Please visit the below website for more information and registration!